28. SEP 2018

LIPS Presents Use Case of Intel’s RealSense 3D Depth Camera

[September 28th, 2018 Taipei, Taiwan] 

LIPS Corporation announced today that it will be showcasing a number of use cases of Intel’s RealSense 3D depth camera at the Intel Executive Summit 2018, taking place in Taipei on Friday 28 September 2018.

At the forum, LIPS will demonstrate its latest 3D facial recognition and 3D metrology solutions, both using Intel’s RealSense 3D depth camera. “We are very proud to introduce our latest 3D applications to the Intel community”, said Luke Liu, CEO of LIPS. “Thanks to the excellent quality and affordable market price offered by Intel’s RealSense 3D depth camera product family, we are very glad to work together with Intel to develop and migrate our latest 3D applications using the RealSense product family”

With the live 3D image taken from Intel’s RealSense camera, LIPS’ facial recognition solution is a true 3D solution not only recognizing feature points and land marks on a human face, but also being able to distinguish a live person from other objects such as a picture. In addition to the facial recognition solution, LIPS also introduced its advanced 3D metrology solution using RealSense camera. LIPS has been in talks with several tablet and laptop manufacturers to enable their devices with an integrated solution.

News Contact:

Anna Chien

+886 2 8791 6998 ext. 202